127 startups raised $2.6 billion, with significant funding raised by data center connectivity, quantum computing and batteries.
November was the month of major funding rounds, with 10 companies receiving at least $100 million in funding. One is a startup that provides data center connectivity solutions and includes mempool functionality in the latest update to the CXL standard. This month, two quantum computing startups joined the $100 million+ club: one is using very cold atoms to make not only quantum computing possible, but also atomic clocks and radio frequency, and the other is applying a photonic approach to achieve quantum leaps that can be achieved with the help of a plant for the production of modern fault-tolerant systems for the production of microcircuits.
The two largest rounds of funding this month went to EV battery makers, and both companies are using the funds to expand production. Batteries performed generally well for the month, with 23 companies featured in this report, the highest total investment in the industrial sector. Investors are looking beyond battery manufacturing: Several startups have been funded to give a second life to EV batteries that are no longer suitable for a car and improve the recycling process.
There has been a notable lack of funding for AI hardware companies this month. However, many other interesting technologies have been funded, including MEMS foundries, interposerless chip interconnects, electrical rule checking, and 3D imaging of any screen. Here are 127 startups that collectively raised over $2.6 billion in November 2022.
Astera Labs raised $150.0M in Series D funding led by Fidelity Management & Research, joined by other existing investors including Atreides Management, Intel Capital, and Sutter Hill Ventures. Astera Labs raised $150.0M in Series D funding led by Fidelity Management & Research, joined by other existing investors including Atreides Management, Intel Capital, and Sutter Hill Ventures. Astera Labs привлекла 150 миллионов долларов в рамках финансирования серии D под руководством Fidelity Management & Research, к которым присоединились другие существующие инвесторы, включая Atreides Management, Intel Capital и Sutter Hill Ventures. Astera Labs has raised $150 million in Series D funding led by Fidelity Management & Research joined by other existing investors including Atreides Management, Intel Capital and Sutter Hill Ventures. Astera Labs 在由Fidelity Management & Research 牵头的D 轮融资中筹集了1.5 亿美元，其他现有投资者也跟投，包括Atreides Management、Intel Capital 和Sutter Hill Ventures。 Astera Labs 在由Fidelity Management & Research Astera Labs привлекла 150 миллионов долларов в рамках финансирования серии D под руководством Fidelity Management & Research при участии других существующих инвесторов, включая Atreides Management, Intel Capital и Sutter Hill Ventures. Astera Labs has raised $150 million in Series D funding led by Fidelity Management & Research with participation from other existing investors including Atreides Management, Intel Capital and Sutter Hill Ventures. Astera Labs provides data and memory connectivity solutions for data centers. It provides a family of intelligent retimers for Compute Express Link (CXL) 2.0 and PCI Express (PCIe) 4.0/5.0 for high performance servers, storage, cloud and workload optimized systems. It also offers intelligent Ethernet cable modules to overcome range, signal integrity, and bandwidth usage issues in 100G/channel Ethernet connections for switch-to-switch and switch-to-server applications. Astera Labs’ latest product is a memory connectivity platform that uses the CXL standard to support memory expansion, memory pooling, and memory sharing in next-generation heterogeneous and composable data center architectures. Headquartered in Santa Clara, California, USA, was established in 2017.
Eliyan Corporation completed a $40 million Series A round led by Tracker Capital, followed by Celesta Capital and strategic investors including Intel Capital and Micron Ventures. Eliyan’s chiplet interconnect technology runs on organic substrates and does not require advanced packaging solutions such as silicon adapters. Its NuLink technology, which is a superset of Bunch of Wire (BoW) and Universal Chiplet Interconnect Express (UCIe), is a direct (D2D) PHY that combines various functions in a single package on any carrier. Elian claims that recent 5nm ribbon technologies have doubled the bandwidth while consuming half the power of today’s interconnect methods. The company has also developed technologies to implement 2.5/3D that can mix and match chiplets with different interfaces between chips in different processes such as DRAM and SOI. Eliyan CEO and co-founder Ramin Farjadrad. “Our approach supports and is consistent with the industry-wide transition to chip-optimized interconnect protocols, including the UCIe standard, as well as the High-Bandwidth Memory (HBM) protocol.” . Headquartered in Santa Clara, California, USA, established in 2021.
Cornelis Networks has raised $29 million in Series B funding led by IAG Capital Partners with participation from Adit Ventures, Foresight Group, Intel Capital, KittyHawk Ventures, Ridgeline Partners and SQN Venture Partners. Cornelis Networks manufactures high performance interconnects to accelerate technical computing workloads in HPC, AI and ML. The Accelerated Host Fabric Adapter is designed to provide semantic matching between real HPC applications and scalable fabrics with scalable throughput in 100 Gb/s increments, 250 MPI messages per second, and sub-microsecond MPI latency. cards, edge switches, director level switches, gateways and cables. The funds will be used to enhance the company’s go-to-market capabilities and accelerate the implementation of its roadmap. Founded in 2020 and headquartered in Wayne, Pennsylvania, USA.
Beizhong Netcom has raised Pre-A Series funding from Rising Investments. The startup is developing Data Processing Units (DPUs) for SmartNICs and programmable cybersecurity chips. Headquartered in Chengdu, China, was established in 2020.
LinJoWing received angel investments from SDIC, Huaxia Capital and Changjiang Securities. LinJoWing develops chips for GPUs and video cards. Its current products are focused on desktop computers, embedded graphics applications, industrial control computers, and military applications. Headquartered in Wuhan, China, established in 2021.
X-Epic has raised hundreds of millions of yuan (100 million yuan or about $13.9 million) in Series B funding led by CICC Capital, China Electronics Corporation and Wuhan Optics Valley United Group, with Mirae Asset and Henglu Assets following suit. X-Epic provides a set of validation tools, including an FPGA prototyping system, a digital simulator, an advanced language validation system based on the Portable Stimulus Standard (PSS) for automated test case generation, a scalable word-based formal validation, a simulation, and a debugging solution. He also provides validation advice. The funds will be used to expand the range of products and recruitment. The headquarters in Nanjing, China was established in 2020.
Aniah has raised 6 million euros ($6.2 million) in Series A funding led by Supernova Invest, with contributions from BNP Invest, Crédit Agricole Sud Rhône-Alpes and Bpifrance. Aniah develops full-chip electrical rule verification software. He aims to give analog and digital design engineers the benefits of formal transistor-level verification and claims that his tools can exhaustively detect errors while speeding up whole-chip analysis. “Aniah has presented a true technological breakthrough in eliminating electrical design errors in the semiconductor industry. The simple, pedagogical and unobtrusive approach to engineers will appeal to key players in the electronics manufacturing chain as it ensures that future electronic devices enter the market in a timely manner. product launch time,” said Richard Moustjes, chairman of Aniah’s board of directors. The funding will be used for international expansion, especially in Asia, the US, and Israel, as well as the possible development of new modules for chip reliability analysis, design project monitoring, and AI-based computer-aided design. It was founded in 2019 and is headquartered in Grenoble, France.
Atomica Corp has raised $30 million in Series C funding from Cerium Technology Ventures, Novo Tellus Capital Partners and St. cloud capital. Atomica is a MEMS foundry with specialized platforms for photonics, sensors, biochips, relays and switches, and specialized MEMS. The company works with a wide range of processes and materials including precious metals, polymers and substrates such as silicon, SOI, glass, fused silica, quartz, borosilicates, piezoceramics and III-Vs. It currently operates a 130,000 square foot manufacturing campus. These funds will be used to expand foundry capacity and advance MEMS technology. Originally known as Innovative Micro Technology (IMT), it was created in 2000 as a reorganization of Applied Magnetics Corporation. Acquisition in 2018 resulted in a new owner. It is located in Santa Barbara, California, USA.
Elephantech raised 2,150.0M yen (~$14.4M) in funding from ANRI Investment, Shin-Etsu Chemical, Nose Investment, Shizuoka Capital, Eiwa Corporation, Nanobank, Mitsubishi Gas Chemical, Kebishi Sake Brewing, D&I Investment, Seiko Epson, Sumimoto, East Ventures, and Beyond Next Ventures. Elephantech raised 2,150.0M yen (~$14.4M) in funding from ANRI Investment, Shin-Etsu Chemical, Nose Investment, Shizuoka Capital, Eiwa Corporation, Nanobank, Mitsubishi Gas Chemical, Kebishi Sake Brewing, D&I Investment, Seiko Epson, Sumimoto, East Ventures , and Beyond Next Ventures. Elephantech привлекла 2 150,0 млн иен (~ 14,4 млн долларов США) от ANRI Investment, Shin-Etsu Chemical, Nose Investment, Shizuoka Capital, Eiwa Corporation, Nanobank, Mitsubishi Gas Chemical, Kebishi Sake Brewing, D&I Investment, Seiko Epson, Sumimotos, East Venture. Elephantech raised ¥2,150.0 million (~$14.4 million) from ANRI Investment, Shin-Etsu Chemical, Nose Investment, Shizuoka Capital, Eiwa Corporation, Nanobank, Mitsubishi Gas Chemical, Kebishi Sake Brewing, D&I Investment, Seiko Epson , Sumimotos, East Venture. and Beyond Next Ventures. Elephantech 从ANRI Investment、Shin-Etsu Chemical、Nose Investment、Shizuoka Capital、Eiwa Corporation、Nanobank、Mitsubishi Gas Chemical、Kebishi Sake Brewing、D&I Investment、Seiko Epson、Sumimoto、East Ventures 筹集了21.5 亿日元（约合1440 万美元）的资金和Beyond Next Ventures。 Elephantech 从ANRI Investment、Shin-Etsu Chemical、Nose Investment、Shizuoka Capital、Eiwa Corporation、Nanobank、Mitsubishi Gas Chemical、Kebishi Sake Brewing、D&I Investment、Seiko Epson、Sumimoto、East Ventures raised 21.5 亿日元（约合1440万US$) funds and Beyond Next Ventures. Elephantech has raised ¥2.15 billion (approximately $14.4 million) in funding from Beyond Next Ventures. Elephantech offers a technology for the production of printed circuit boards based on inkjet printing, which it claims is environmentally friendly, reducing CO2 emissions by 77% and water consumption by 95% compared to traditional production methods. The startup claims that its technology can be applied to virtually any type of printed circuit board. Currently, the main focus is on single-sided flexible substrates, and in the future it is planned to release multilayer and rigid printed circuit boards. It is also aimed at expanding the possibilities of printing on biomass substrates and using recycled materials. The funding will be used for the global expansion and expansion of the application of this technology. Founded in 2014 with headquarters in Tokyo, Japan.
CanSemi raised hundreds of millions of yuan (100 million yuan, or about $13.9 million) in a series B round with investments from Guangzhou Kechuang Industry Investment Fund, Guangdong Semiconductor and Integrated Circuit Industry Investment Fund and CCB Capital. CanSemi is a 12″ analog wafer foundry specialized in mid to high end industrial and automotive grade analog ICs. The first two phases of his project, involving the creation of the 180-90 nm process technology, and then the 90-55 nm process technology, have already been completed. The funding will be used for the third phase, expanding the available nodes to 55-40nm. It is expected that after the completion of the third stage, about 80,000 12-inch plates per month will be produced. The company plans to eventually adopt a 22nm process. Founded in 2017 and headquartered in Guangzhou, China.
Getech Technology has raised hundreds of millions of yuan (100 million yuan or about $13.9 million) in a Series B round from SAIC-owned Hengxu Capital and Guangdong Financial Fund. Getech produces computer-integrated manufacturing (CIM) software for semiconductor manufacturing and other industries, including new energy, consumer electronics and automotive. The products cover plate production, packaging and testing, and finished product assembly, and support multi-shop and multi-factory production management. The funds will be used to increase investment in semiconductor products, with a particular focus on artificial intelligence and big data for software and algorithmic devices. TCL was founded in 2018 and headquartered in Guangzhou, China.
NeuCloud has raised hundreds of millions of yuan (100 million yuan or about US$13.9 million) in Series C+ funding from the Beijing Integrated Circuit Equipment Industry Fund, CRRC Capital and the China Internet Investment Fund. NeuCloud provides a platform for collecting, managing and analyzing industrial data. The company says that for semiconductor manufacturing, its platform can be used to measure the performance of IC production lines and identify output issues. It can also be deployed by semiconductor equipment vendors to monitor equipment performance during operation and provide product maintenance capabilities. The platform is also used in other manufacturing, energy, petrochemical, rail transport and other industries. Founded in 2013, headquartered in Beijing, China.
SRI Intellectual Technology (SRII) has received hundreds of millions of RMB (RMB 100 million or approximately US$13.9 million) in Series A funding from Oceanpine Capital, Stony Creek Capital, etc. The company owns Beneq, a Finnish company that manufactures equipment for atomic layer deposition (ALD), and its subsidiary Lumineq, which produces transparent displays for optical devices and vehicles. Funds will be used for R&D and production line upgrades. Funds will be used for R&D and production line upgrades. The funds will be used for R&D and upgrading of the production line. The funds will be used for research and development and the modernization of the production line. SRII acquired Beneq in 2018. Headquartered in Qingdao, China, established as a joint venture in 2018.
Jet Plasma Technology has raised 100 million yuan (approximately US$13.9 million) in Series D funding from PH Investment, Shanghai Lingang Innovation Center, Jucheng Capital, Xu Nuo Capital and others. The company manufactures plasma cleaning and surface treatment equipment for the packaging of semiconductor chips, composite semiconductors, LEDs, consumer electronics, medical electronics, and the production of functional materials. Headquartered in Shanghai, China, was established in 2015.
Enovate3D has raised nearly 100 million yuan (about $13.9 million) in Series A funding led by Hikvision, joined by Sequoia Capital China and Walden International. The electronic 3D printing devices manufactured by Enovate3D are capable of creating features as small as 1 to 10 microns for the additive manufacturing of high-performance metallic conductive materials, polymers, ceramic-based dielectric materials, and flexible electronic materials. It also offers 3D printing services. Funds will be used for R&D, hiring, and construction of a production base. Funds will be used for R&D, hiring, and construction of a production base. The funds will be used for research and development, hiring and building a production base. The funds will be used for research and development, hiring and building a production base. Founded in 2020 and headquartered in Hangzhou, China.
Zeta Tech has raised nearly 100 million yuan (about $13.9 million) in a Series A round led by Hefei Industrial Investment Group and Glory Ventures, with participation from South China venture capital. Zeta Tech provides computer-integrated manufacturing (CIM) software for data integration, big data analysis, yield management, and equipment utilization in semiconductor manufacturing and packaging. It also provides consulting services for smart manufacturing planning. In addition to semiconductors, its products are also suitable for the production of display panels, photovoltaic and lithium batteries. Funds will be used for R&D, hiring, and product iteration, including adding manufacturing execution, quality management, equipment material management, equipment automation, and other systems, as well as increased integration with big data and AI applications. Funds will be used for R&D, hiring, and product iteration, including adding manufacturing execution, quality management, equipment material management, equipment automation, and other systems, as well as increased integration with big data and AI applications. The funds will be used for research and development, recruitment, and product iteration, including adding manufacturing, quality management, equipment material management, equipment automation, and other systems, and strengthening integration with big data and artificial intelligence applications. The funds will be used for research and development, recruitment, and product iteration, including adding systems such as manufacturing management, quality management, equipment materials management, equipment automation, and increased integration with big data and artificial intelligence applications. Headquartered in Shanghai, China, was established in 2017.
Goodled Precision Optoelectronics, also known as Goodun, has raised 50 million yuan (approximately $7 million) in A+ series funding. Goodun manufactures UVA, UVB, UVC and NIR LED chips and modules based on III-V semiconductor junctions. The company offers these products in UV curing equipment used in consumer electronics and battery manufacturing, among others. Founded in 2005, headquartered in Changzhou, China.
Amplio has raised $6 million in seed funding led by Construct Capital with participation from Slow Ventures, High Alpha Capital, Flexport Ventures, Alpaca Venture Capital and individual investors. The startup provides a supply chain management platform for electronic components. The company said it can track components at the highest risk of shortage and connect customers to alternative sources of supply. It also provides group purchasing to reduce the cost of the BOM. Headquartered in Atlanta, Georgia, USA, was established in 2021.
SparkNano has raised €5.5 million ($5.4 million) in funding led by ALIAD Air Liquide with participation from Somerset Capital Partners, Invest-NL and existing investors Innovation Industries, Brabant Development Company and TNO. SparkNano is developing Spatial ALD technology for the fabrication of electrolyzers for the production of green hydrogen, fuel cells, batteries, solar cells and displays. Instead of using a vacuum chamber, the startup describes its technology as an ALD printhead that floats above the substrate and delivers gaseous precursors that are separated from each other by a shield of inert gas. It can be used to deposit a range of precisely matched thin films and minimize the use of precious elements such as iridium and platinum. SparkNano offers products ranging from flexible R&D tools to high-volume and large-area mass production tools for both sheet-to-sheet and roll-to-roll production. SparkNano offers products ranging from flexible R&D tools to high-volume and large-area mass production tools for both sheet-to-sheet and roll-to-roll production. SparkNano offers products ranging from flexible R&D tools to high volume and high volume mass production tools for both sheet and roll production. SparkNano’s offerings range from flexible R&D tools to high-volume and large-scale production tools for board-to-board and roll-to-roll production. The funds will be used to accelerate business expansion. It is a subsidiary of TNO Holst Center established in 2018 and headquartered in Eindhoven, the Netherlands.
Litilit received an investment of 3.5 euros (approximately $3.5 million) from Taiwania Capital’s Central and Eastern Europe Investment Fund. Litilit’s ultrashort pulsed femtosecond lasers can be used to process many different electronic materials and are suitable for rigid PCBs, flexible PCBs and rigid-flex PCBs. Its lasers are also used in ceramic processing, multiphoton microscopy and medical applications. It was founded in 2015 and is headquartered in Vilnius, Lithuania.
Accuracy Int Tech, also known as Akeris Intelligent Equipment, has raised tens of millions of yuan ($1.4 million) in funding from Hefei Angel Fund and Kewell Technology. Akeris manufactures equipment for shredding and cutting wafers from 6″ to 12″. Headquartered in Hefei, China, established in 2019.
Lebo Semi received tens of millions of yuan (10 million yuan or about US$1.4 million) in Series A funding from Shenzhen Venture Capital and Zhongmao Capital. Loeb Semiconductor manufactures equipment for the production of semiconductors. Its products include automatic and semi-automatic gluing, developing, stripping and cleaning equipment, as well as formic acid reflow soldering machines. The main applications are composite semiconductors, LEDs and MEMS. Founded in 2013 and headquartered in Jiangsu, China.
Younme has received tens of millions of yuan (10 million yuan or about US$1.4 million) in a Pre-A funding round from Ningbo Huatong Venture Capital and Suzhou Rongyue Investment. The startup makes devices with forced control, which are used for the production of consumer electronics. The company plans to expand the production of lithium batteries and photovoltaic cells. Headquartered in Suzhou, China, established in 2018.
GDH has raised 165 million yuan ($23.5 million) in funding from Guangzhou Industrial Investment Group and other companies. The startup offers wafer-level packaging for image sensor chips, fingerprint recognition chips, MEMS, and RF devices. The funds will be used to build an 8-inch/12-inch through-silicon (TSV) packaging line for CMOS image sensors (CIS) and filters. Founded in 2022 and headquartered in Guangzhou, China.
CD Micro Technology, also known as Chengdu Maike, has raised tens of millions of yuan (10 million yuan or about $1.4 million) in Series A funding from Sichuan Development, Deer Laser and Yizhan Capital. The company produces substrates through glass through (TGV), integrated passive devices (IPD) and 3D microstructured glass. It also provides TGV technology services and develops TGV process equipment for 3D packaging, high-Q microwave/THz devices, optical/RF MEMS, and microfluidic chips. Funds will be used for R&D of TGV applications and working towards mass production. Funds will be used for R&D of TGV applications and working towards mass production. The funds will be used for research and development of TGV applications and mass production work. The funding will be used for research and development and mass production of TGV applications. Headquartered in Chengdu, China, was established in 2017.
TCPack invested in Xingbang Advanced Manufacturing Fund. The company manufactures metal packages, ceramic packages, thermal compounds and small size packages (SOP) for optical communication equipment, industrial lasers, sensors, RF modules and power electronics. Headquartered in Hefei, China, established in 2017.
Dongfang Jingyuan Electron Limited (DJEL) raised nearly CNY 1,000.0M (~$139.6M) in private equity financing from Xingcheng Capital, E-town International Investment & Development, Xin Ding Capital, Green Pine Capital Partners, CGII Private Fund, Silk Road Huachuang, Red Horse Capital, An Xin Capital, CoStone Capital, Five Bulls Fund, China Capital Management, Haier Capital, CCB International, Nuo Capital, and others. Dongfang Jingyuan Electron Limited (DJEL) привлекла почти 1000,0 млн юаней (~ 139,6 млн долларов США) в виде прямых инвестиций от Xingcheng Capital, E-town International Investment & Development, Xin Ding Capital, Green Pine Capital Partners, частного фонда CGII, Silk Road Huachuang, Red Horse Capital, An Xin Capital, CoStone Capital, Five Bulls Fund, China Capital Management, Haier Capital, CCB International, Nuo Capital и другие. Dongfang Jingyuan Electronics Co., Ltd. (DJEL) от Xingcheng Capital, Yizhuang International Investment Development, Xinding Capital, Qingsong Capital, CGII Private Equity Fund, Silk Road Huachuang, Red Horse Capital, Anxin Capital, Cornerstone Capital, Wuniu Fund, Huaxia Capital , Haier Capital, CCB International, NUO Capital и др. DJEL предлагает решения для управления доходностью, программное обеспечение для коррекции оптической близости (OPC), оборудование для электронно-лучевого контроля, а также 8-дюймовые и 12-дюймовые сканирующие электронные микроскопы критических размеров (CD-SEM). Funds will be used for new product R&D and construction of manufacturing facilities. Средства будут использованы для исследований и разработок новых продуктов и строительства производственных мощностей. Средства будут направлены на разработку новых продуктов и строительство производственных мощностей. Основана в 2014 году, штаб-квартира находится в Пекине, Китай.
Mega Phase Technology received nearly 100 million yuan (approximately US$13.9 million) in Series B funding from Richen Capital. The startup makes structured light 3D computing cameras for visual inspection of chips, surface mount technology (SMT), consumer electronics, lithium batteries and other precision manufacturing applications. Funds will be used for R&D and production capacity expansion. Funds will be used for R&D and production capacity expansion. The funds will be used for research and development and expansion of production capacity. The funding will be used for research and development and capacity expansion. Founded in 2014, headquartered in Shanghai, China.
LightE Technology has raised tens of millions of yuan (10 million yuan or about US$1.4 million) in Series A funding from Broadstream Capital. LightE Technology manufactures spectral confocal displacement sensors for 3D optical inspection of semiconductors, printed circuit boards, consumer electronics, photovoltaic cells, lenses and other applications. The startup says the technology offers higher precision, broader material applicability, and greater stability than conventional lasers. The company is currently mass-producing point confocal sensors and prototypes of linear confocal products. It is also planned to develop hyperspectral sensors + artificial intelligence sensors and fiber optic sensors. Funds will be used for mass production of linear confocal sensors and R&D. Funds will be used for mass production of linear confocal sensors and R&D. The funds will be used for serial production of linear confocal sensors and R&D. The funds will be used for mass production and R&D of the linear confocal sensor. Headquartered in Shenzhen, China, was established in 2014.
Pi Semiconductor received tens of millions of yuan (10 million yuan is approximately $1.4 million) in Series A+ funding from Addor Capital. The startup produces probe card substrates and loading boards for wafer testing and final testing. The company plans to move to multilayer organic (MLO) substrates and ceramic substrates. Headquartered in Nantong, China, established in 2021.
Weichong Semiconductor has raised tens of millions of yuan (10 million yuan or about $1.4 million) in Pre-A+ and Pre-A++ funding rounds, including investments from Huaxia Fuqiang, Sunic Capital and Yunqi Capital. The startup develops equipment for non-contact non-destructive testing of optical wafers in real time. Funds will be used for R&D, mass production of first-generation products, and hiring. Funds will be used for R&D, mass production of first-generation products, and hiring. The funds will be used for research and development, mass production of first generation products, and staff recruitment. The funds will be used for research and development, mass production and a set of first generation products. Headquartered in Beijing, China, established in 2021.
GT AI, also known as Gantu Technology, has raised a Series C1 funding round after a Series C round earlier this year. GT AI provides computer vision inspection, monitoring and AI decision making, mainly focusing on high performance PCBs. Its products include intelligent monitoring of flexible printed circuit board (FPC) production line operations, monitoring of all FPC SMT process equipment, and defect and revenue management systems. The company plans to expand into other manufacturing areas such as solar panels, batteries and automobiles, as well as apply its computer vision technology to logistics and retail. The funds will be used for product development and overseas expansion. Founded in 2018 and headquartered in Shanghai, China.
P2i has raised £15 million ($18.1 million) in debt financing from HSBC’s Growth Loan Fund. P2i has developed nanotechnology for waterproofing and electrical barrier coatings for electronics. Its ultra-thin protective coating makes the PCB IPX8 waterproof, has the potential to reduce e-waste, and is more environmentally friendly than existing protective coatings, the company said. The funds will be used to expand operations, invest in new equipment and enter the automotive and medical markets. Founded in 2004 and headquartered in Milton Park, England, UK.
Kanatu has raised 18 million euros ($17.9 million) in funding from 3M Ventures, Ascend Capital Partners, eFruit International and new investors including Minth Group, Nordea and Varma Mutual Pension Insurance Company. Canatu develops carbon nanotube (CNT) materials for the semiconductor and automotive industries. Its carbon nanotubes are used in extreme ultraviolet (EUV) lithography films that protect photomasks during photolithography. The startup claims its self-contained membrane provides up to 97% single-pass EUV transmission with a low and correctable imaging impact. It is also suitable for high numerical aperture EUV. Other applications for its carbon nanotubes include optically transparent thin film heaters for automotive cameras and lidar sensors, 3D touch sensors, and electrochemical sensors. “With this new funding round, we will be able to accelerate the company’s growth in the semiconductor and automotive markets and expand our automated production lines in Finland. the art of carbon nanotube technology,” said Canatu CEO Juha Kokkonen. Founded in 2004 as an offshoot of Aalto University’s Nanomaterials Group and headquartered in Vantaa, Finland, the company has raised €74 million to date.
Niron Magnetics received $17.5 million in funding from the US Department of Energy. Niron Magnetics manufactures high performance, rare earth-free iron nitride permanent magnets. High-performance magnets find applications in hard drives, as well as electric vehicle transmissions, home appliances, audio speakers, and industrial and commercial environments such as wind turbines, elevators, and HVAC systems. Niron says its magnets are cheaper than rare earth alternatives and inherently have a higher magnetization. “As the demands of the storage market continue to grow, innovation is critical to finding a replacement for the magnets used in disk read/write heads and spindle drive motors while avoiding the environmental impact of rare earth mining and reducing supply risk. breakthroughs,” said Andy Blackburn, CEO of Niron Magnetics. The grant will be used to develop commercial partnerships and pilot production. Founded in 2015 as a subsidiary of the University of Minnesota and headquartered in Minneapolis, Minnesota, USA.
Actnano has raised $8 million in non-dilutive growth financing from Liquidity Group. Actnano offers waterproof and environmentally resistant nano-coating technologies for automotive and consumer electronics. This fluorine-free, non-toxic, and environmentally friendly technology provides complete PCB protection, including connectors, antennas, LEDs, and high-heat components. The company says its coatings are used to protect electronics on more than 2 million production vehicles, including 80% of electric vehicles in North America. The funds will be used to support ongoing global expansion into automotive markets such as Germany, Korea, and Japan, as well as for R&D. The funds will be used to support ongoing global expansion into automotive markets such as Germany, Korea, and Japan, as well as for R&D. The funds will be used to support ongoing global expansion into automotive markets such as Germany, Korea and Japan, as well as research and development. The funds will be used to support further global expansion, research and development in automotive markets such as Germany, South Korea and Japan. Headquartered in Cambridge, Massachusetts, USA, was founded in 2012.
Changzhou Zhenjing Semiconductor has received a strategic investment of 25 million RMB (approximately US$3.5 million) from NCEPower. The company manufactures 6-inch and 8-inch silicon carbide (SiC) substrates. Its manufacturing process covers from growing and processing liquid crystals to processing, cleaning and testing wafers. They are expected to start offering products in 2024. The company was founded in 2020 and is headquartered in Changzhou, China.
Shineray New Materials has raised tens of millions of yuan (10 million yuan or about US$1.4 million) in a Pre-A funding round from Yuanhe Holdings, South China Venture Capital and Nuoyan Capital. The startup produces thermal interface materials for electronic cases, including cases for power semiconductors. Its products include sintered silver materials, semi-sintered conductive adhesives, soldering materials and electromagnetic shielding materials. Target applications include new energy vehicles, RF communications, power transmission, photovoltaics and optoelectronics. Headquartered in Shenzhen, China, established in 2022.
AST, also known as Super Silicon Semiconductor, has received B+ funding from Guolian Group, China Structural Reform Fund Corporation and Jadestone VC. The company produces polished silicon wafers with a diameter of 200 mm and 300 mm, epitaxial wafers and wafers annealed in argon. Founded in 2008 and headquartered in Shanghai, China.
Nanzhi Core Materials received an angel investment from Guofa Venture Capital. The launch produces optical grade lithium niobate crystals for use in SAW RF filters, electro-optical modulators, infrared detectors, and laser frequency doubling crystals. Founded in 2021 and headquartered in Suzhou, China.
PowerEpi receives new funding from SDIC Ventures. The launch produces epitaxial materials based on silicon carbide (SiC). The funds will be used to accelerate product development and capacity expansion. Headquartered in Dongguan, China, established in 2020.
Biomemory has raised €5 million (~$5.2 million) in seed funding from eureKARE, Bpifrance, Paris Business Angels, Prunay Impact and existing individual investors Octave Club, Flavien Kulavik, Raduan Harbichi, Eric Carril and Jean David Benichou. Biomemory is developing a DNA data warehouse using synthetic biology-based synthesis and replication processes. This process produces long DNA fragments that can be stored as inert polymers for thousands of years without any expenditure of energy. In addition to a much higher density than tape or SSDs, the startup says its storage technology can bring costs down to $1 per megabyte, compared to $1 per kilobyte for current DNA synthesis solutions. Finally, it is expected to reach $1 per TB. a fully integrated and continuous microfluidic DNA assembly device after further terminal optimization. The proceeds will be used to expand Biomemory’s DNA synthesis technology, which is designed to be compatible with big data. Headquartered in Paris, France, founded in 2021.
InnoGrit has completed a new funding round. The company manufactures PCIe NVMe SSD controllers for consumer and enterprise applications. It focuses on security, power and performance, offering multiple encryption and data protection schemes. It also provides turnkey design services as well as reference designs. Founded in 2016, headquartered in Shanghai, China.
AD Microchip (ADUC) has received tens of millions of yuan (10 million yuan or about US$1.4 million) in A+ series funding from Qin Chuangyuan Xinhuo Innovation Fund and others. ADUC manufactures high and low voltage mixed signal ICs. Its products include 32-bit MCUs, 8-bit Flash and OTP MCUs, battery management ICs, and USB Type-C Power Delivery (PD) ICs. It is mainly focused on consumer electronics. Funds will be used for R&D, to expand product lines, and update testing equipment. Funds will be used for R&D, to expand product lines, and update testing equipment. The funds will be used for research and development, product line expansion and testing equipment upgrades. The funds will be used for research and development, product line expansion and testing equipment upgrades. Founded in 2013 and headquartered in Xi’an, China.
Modulo Smart Core Microelectronics has received tens of millions of yuan (10 million yuan or approximately US$1.4 million) in angel investments from Zijin Hi-Tech Venture Capital and other companies. A startup develops analog ICs. At present, a 24-bit high-precision ADC is provided, and low-power ADCs and DACs are close to mass production. He also works on other converter ICs, medical analog interface ICs, isolators and Battery Management System (BMS) ICs. Funds will be used for hiring and R&D. Funds will be used for hiring and R&D. The funds will be used for recruitment and R&D. The funding will be used for recruitment and research and development. Target applications include medical electronics, smart manufacturing, new energy and automotive electronics. Headquartered in Nanjing, China, established in 2022.
Soundec received tens of millions of yuan (10 million yuan or about US$1.4 million) in Series B funding from Qingyuan Capital and Jolmo Capital. The audio signal processing SoCs developed by Soundec include high performance low power DSP processor, ADC, DAC, USB, memory and rich interfaces. The company also develops analog audio chips and a range of audio signal processing algorithms. Target applications include headsets, digital microphones, and multiple microphone array products for IoT devices, smart homes, smart cars, and hearing aids. The funds will be used to develop the company’s next-generation audio processing chips, expand the business, and hire employees. Headquartered in Shenzhen, China, was established in 2017.
Post time: Dec-12-2022